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【Event
Information: Bridging the Electro-Thermal Divide】
Tuesday, August 29, 2017 11:00 am (台灣時間)
Eastern Daylight Time (New York, GMT-04:00)
Abstract:
This webinar will discuss electro-thermal design
solutions to problems resulting from increased power densities in
electronic products. But in order for these solutions to actually work,
Electrical and Mechanical Engineers need a better way to design and collaborate
so that electronic products are robust and meet reliability
specifications.
That’s
exactly what ANSYS HFSS provides. It now incorporates ANSYS Icepak within
the Electronics Desktop, puts “Predictive Thermal Design” directly into
the hands of Electrical Engineers and enables them to improve
collaboration with Mechanical Engineers. ANSYS Icepak features highly
accurate predictive simulation based on Computational Electromagnetics
and Fluid Dynamics, and engineers can easily share models and results
with each other. This collaborative approach truly provides a better way
for engineers to solve electro-thermal problems of any model designed in
Mechanical CAD (MCAD) or Electrical CAD (ECAD). Join us as we cover
topics that go from “Chip to Product” and learn how ANSYS simulation
software reliably predicts electro-thermal behavior over staggering
scales of size that range from a 7nm silicon device to a 15m-long fighter
jet.
Presenter Bio:
Dr. Steven Gary Pytel, Jr. is the Lead Electronics Business Product
Manager at ANSYS, Inc. He previously worked at Intel Corporation as a
Senior Signal Integrity and Hardware Design Engineer, where he helped
design Blade, Telecom, and Enterprise servers. He has over 50
publications with an invited book chapter on signal integrity simulation
within Maxwell’s Equations: The Foundations of Signal Integrity authored
by Paul Huray.
Event:
Event Information: Bridging the Electro-Thermal Divide
Tuesday, August 29, 2017 11:00 am (台灣時間)
Eastern Daylight Time (New York, GMT-04:00)
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