SiP Modeler for ANSYS is an add-on tool for ANSYS multi-physics simulation platform which is a metaphor of an APP for smart phone.
Using SiP modeler, engineers can design a SiP module simply select electronic components and place them on to the substrate or PCB. With proper property assigned for each material, an APDL script can be generated by a single click on a button. Once the APDL script is imported into ANSYS, a meshed model of the SiP will be constructed in ANSYS and the material properties are all assigned.
Loading conditions can also be included in APDL script and, therefore, the stress simulation is just “One Click” away.
The meshed model can be used to generate a CDB file, which can be used to construct a structural model in ANSYS Workbench for other simulation tasks such as thermal simulation in ANSYS Icepak.
Benefits and Advantages
An user friendly interface for System-in-Package mechanical and thermal design modeling
Includes enriched electronic package component library