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亞太區ANSYS R18線上發表會(AIM+電子散熱+高頻+SpaceClaim+低頻+Simplorer)
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各位用戶們好！
ANSYS R18.0 新版本已經上線，完整主程式都可以在 Customer Portal
網站取得：
https://support.ansys.com/portal/site/AnsysCustomerPortal
(僅限維護期內用戶登入)
ANSYS 原廠針對亞太地區用戶，開設了以下時段的新功能發表會，歡迎踴躍報名：
►【ANSYS AIM 單一環境多重物理分析求解器】
ANSYS 18 Innovations - ANSYS AIM
日期：2017年3月14日(星期二)
時間：台灣時間下午兩點(GMT+8時區)
講者：Ramsobhan K
內容簡介： With ANSYS AIM, organizations
can accelerate product design through upfront simulation, eliminate
late-stage design changes and reduce the number of costly physical
prototypes. AIM makes upfront simulation easy by combining intuitive,
guided workflows, accurate simulation results and customization in a
complete simulation tool covering a broad range of physics.
Join us for this webinar as we
explore some of the major ANSYS 18.0 release highlights through live
demonstrations. Topics will include:
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Extended collaboration between
designers and analysts
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Simultaneous post-processing of
multiple simulation results
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Simulation of one-way
fluid-structure interaction with structural shell elements
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The use of expressions for
capturing real-world conditions
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報名連結：
►【電子散熱分析新功能介紹】
ANSYS 18 Innovations - Electronics Cooling
日期：2017年3月21日(星期二)
時間：台灣時間下午兩點(GMT+8時區)
講者：K V S
Ravikrishna
內容簡介： ANSYS 18.0 delivers innovative
new solutions for electronics cooling. Thermal integrity is a critical
design consideration for enclosure design, packages, and PCBs that affect
reliability and product lifecycle. Thermal impact on the package,
especially from the IC, is a key driver for material selection, cooling
and form factor decisions that ultimately determine the size, weight and
cost of the final product. It is critical for package and system
designers to determine the thermal signature of their system.
Attend this webinar to learn
about important new capabilities in ANSYS 18.0 regarding electronics
cooling simulation, such as importing chip thermal models (CTM) from
ANSYS RedHawk to ANSYS Icepak for thermal analysis of the complete IC,
package and PCB. Designers of high-speed digital electronics, and thermal
and mechanical engineers involved in electronic design should attend this
informative webinar on electronics cooling analysis.
報名連結：
►【高頻電磁場分析新功能介紹】
ANSYS 18 Innovations - High Frequency Electromagnetics
日期：2017年3月28日(星期二)
時間：台灣時間下午兩點(GMT+8時區)
講者：Nijas
內容簡介： High-frequency,
high-speed electronic devices are increasingly critical for microwave, RF
and high-speed digital applications. ANSYS HFSS software is the industry
standard for simulating 3-D, full-wave, electromagnetic fields for such
applications. Its state-of the-art solver technologies based on finite
element, integral equation, asymptotic and advanced hybrid methods are
essential tools for engineers tasked with executing accurate and rapid
design of high-frequency electronic devices.
Attend this webinar to learn
about the latest innovations in ANSYS HFSS 18.0, including a new
streamlined antenna workflow with an enhanced antenna design kit,
broadband adaptive meshing for improved accuracy and reliability, and the
integration of our Delcross Savant technology into the new HFSS SBR+
(shooting and bouncing ray) workflow. Discover new productivity
enhancements such as breakthrough HPC technology for faster and more
memory-efficient frequency sweeps, and advances in 3-D component
technology that provide a powerful collaborative platform for EM simulation.
報名連結：
►【ANSYS SpaceClaim
Direct Modeler (SCDM)直接建模軟體新功能】
ANSYS 18 Innovations - ANSYS SpaceClaim
日期：2017年4月4日(星期二)
時間：台灣時間下午兩點(GMT+8時區)
講者：Sushilkumar
Sonar
內容簡介： In ANSYS 18.0,
ANSYS SpaceClaim further integrates its ease of use and rapid geometry
manipulation capabilities into common simulation workflows. From large
changes to behind the scenes enhancements, you’ll notice efficiency
improvements across the board.
Join us for this webinar and
learn about several improvements that are guaranteed to save time,
enhance your designs and improve overall usability. We’ll cover:
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Continued development of
SpaceClaim’s scripting environment. With expanded recording capabilities
and replayability of scripts on model versions, you’ll save time in the
steps needed to automate geometry tasks.
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Faceted data optimization and
smoothing enhancements. You can greatly simplify and smooth topology
optimized STL data for downstream printing, while preserving the
integrity of localized regions.
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Lattice Infilling for additive
manufacturing. The Infilling functionality has greatly expanded to
include several lattice infill types, all with custom options to ensure
your 3-D printed component has an ideal strength-to-weight
relationship.
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Exploration of inner details of a
model with the new fly-through capability. Without hiding components or
using cross sections, this capability provides graphical feedback at
your fingertips while making it even more enjoyable to work in a 3-D
environment.
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報名連結：
►【低頻電磁場分析新功能介紹】
ANSYS 18 Innovations - Low Frequency Electromagnetics
日期：2017年4月11日(星期二)
時間：台灣時間下午兩點(GMT+8時區)
講者：Tushar Sambharam
內容簡介： ANSYS 18.0
delivers true innovation for the design of electromagnetic and
electromechanical devices. Engineers and managers involved in the design
of electric motors, transformers, actuators, sensors and other
electromagnetic devices for the automotive, aerospace and industrial
automation industries will benefit from this latest advanced technology
for simulation and design.
Attend this webinar to learn
about the latest enhancements to ANSYS Maxwell, including the industry-first
Time Decomposition Method (TDM) for transient electromagnetic field
simulation. With this patent pending technology, you can solve all time
steps simultaneously and distribute them across multiple cores, networked
computers and compute clusters to greatly increase simulation capacity
and speed. Discover Maxwell’s new automated setup for eccentricity,
advanced anisotropy and vector hysteresis modeling, along with a new
magnetostriction modeling capability that lets you link the electrical
and mechanical performance of electric machines to ensure quiet, robust
design.
報名連結：
►【系統分析與 Simplorer 新功能介紹】
ANSYS 18 Innovations - Systems and Simplorer
日期：2017年4月18(星期二)
時間：台灣時間下午兩點(GMT+8時區)
講者：Reshmi Raghavan
內容簡介： With ANSYS 18, ANSYS Simplorer
provides enhanced capability for modeling complete physical systems, with
a new graphical modeling editor for Modelica, new Reduced-Order Model
interfaces, and compatibility with model libraries from Modelon.
Simplorer also extends its interoperability leadership, providing new and
enhanced connectivity with systems engineering processes, support for FMI
co-simulation, system model identification and closed-loop testing with
embedded software designs in SCADE. Join us as Lee Johnson, Simplorer
product manager, demonstrates these enhancements in this live webinar.
報名連結：
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